A.车|数控车铣|铣|钳等、B.自动车|仪表车|钳等、C.压制|钳|清洗|印字等、D.车|数控车铣|铣|钳等、E.半导体分立器件等
发送至邮箱
A.车|数控车铣|铣|钳等、B.自动车|仪表车|钳等、C.压制|钳|清洗|印字等、D.车|数控车铣|铣|钳等、E.半导体分立器件等
一、采购清单
A.其他、B.其他、C.其他、D.其他、E.其他
二、主要内容
| 标题： | A.车|数控车铣|铣|钳等、B.自动车|仪表车|钳等、C.压制|钳|清洗|印字等、D.车|数控车铣|铣|钳等、E.半导体分立器件等 | ||
| 场次号： | A.XJ*、B.XJ*、C.XJ*、D.XJ*、E.XJ* | 询价开始时间： | A.2024-09-09 20:03:23、B.2024-09-09 20:03:25、C.2024-09-09 20:03:27、D.2024-09-09 20:03:29、E.2024-09-09 20:03:31 |
| 询价结束时间： | A.2024-09-23 00:00:00、B.2024-09-23 00:00:00、C.2024-09-23 00:00:00、D.2024-09-23 00:00:00、E.2024-09-23 00:00:00 | 参与方式： | A.定向询价、B.定向询价、C.定向询价、D.定向询价、E.定向询价 |
| 出价方式： | A.一次性出价、B.一次性出价、C.一次性出价、D.一次性出价、E.一次性出价 | 操作员： | A.吴妙满、B.吴妙满、C.吴妙满、D.吴妙满、E.程玲 |
| 联系人： | A.吴先生、B.吴先生、C.吴先生、D.吴先生、E.程先生 | 联系方式： | A.0571-*、B.0571-*、C.0571-*、D.0571-*、E.010-* |
| 付款方式： | A.、B.、C.、D.、E. | 附件： | (略) |
| 备注： | 全军武器装备 (略) 用户如需获取采购技术要求及资格要求等信息，请联系项目联络人并进行后续流程 | ||
| 产品名称 | 产品标准 | 型号 | 规格 | 质量等级 | 封装形式 | 产品批次 | 备注 | 采购数量 | 最少供应量 | 到货日期 |
| A001.车|数控车铣|铣|钳 | A001.- | A001.FD-50-21 | A001.FD-50-21 | A001.- | A001.无 | A001. | A001. | A001.444.0- | A001.444.0- | A001.2024-09-27 00:00:00 |
| A002.数车 | A002.- | A002.*-21 | A002.*-21 | A002.- | A002.无 | A002. | A002. | A002.30.0- | A002.30.0- | A002.2024-09-28 00:00:00 |
| A003.车|加工中心|钳 | A003.- | A003.*-11.3S | A003.*-11.3S | A003.- | A003.无 | A003. | A003. | A003.10.0- | A003.10.0- | A003.2024-09-09 00:00:00 |
| B001.自动车|仪表车|钳 | B001.- | B001.Y22-3-19 | B001.Y22-3-19 | B001.- | B001.无 | B001. | B001. | B001.500.0- | B001.500.0- | B001.2024-10-09 00:00:00 |
| B002.数控纵切 | B002.- | B002.*-01 | B002.*-01 | B002.- | B002.无 | B002. | B002. | B002.*.0- | B002.*.0- | B002.2024-10-15 00:00:00 |
| B003.数控纵切|仪表车|钳 | B003.- | B003.JYS-0000-103 | B003.JYS-0000-103 | B003.- | B003.无 | B003. | B003. | B003.500.0- | B003.500.0- | B003.2024-09-15 00:00:00 |
| C001.压制|钳|清洗|印字 | C001.- | C001.J7-62-12 | C001.J7-62-12 | C001.- | C001.无 | C001. | C001. | C001.100.0- | C001.100.0- | C001.2024-09-13 00:00:00 |
| C002.压制|钳|清洗|印字 | C002.- | C002.J599-2520-07 | C002.J599-2520-07 | C002.- | C002.无 | C002. | C002. | C002.100.0- | C002.100.0- | C002.2024-09-13 00:00:00 |
| C003.压制|钳|清洗|印字 | C003.- | C003.J599-2520-05 | C003.J599-2520-05 | C003.- | C003.无 | C003. | C003. | C003.100.0- | C003.100.0- | C003.2024-09-13 00:00:00 |
| D001.车|数控车铣|铣|钳 | D001.- | D001.*-105 | D001.*-105 | D001.- | D001.无 | D001. | D001. | D001.6.0- | D001.6.0- | D001.2024-09-04 00:00:00 |
| D002.车 | D002.- | D002.*-13.1 | D002.*-13.1 | D002.- | D002.无 | D002. | D002. | D002.30.0- | D002.30.0- | D002.2024-09-09 00:00:00 |
| D003.车|数控车铣|铣|钳 | D003.- | D003.*-105A | D003.*-105A | D003.- | D003.无 | D003. | D003. | D003.6.0- | D003.6.0- | D003.2024-09-04 00:00:00 |
| D004.加工中心|钳 | D004.- | D004.*-13(a)(b) | D004.*-13(a)(b) | D004.- | D004.无 | D004. | D004. | D004.11.0- | D004.11.0- | D004.2024-09-30 00:00:00 |
| E001.半导体分立器件 | E001.GJB 244A/2A-2001 | E001.BT2907AS | E001.BT2907AS | E001.JCT/K | E001./ | E001. | E001. | E001.208.0只 | E001.208.0只 | E001.2024-10-20 00:00:00 |
| E002.半导体分立器件 | E002.GJB 244A/2A-2001 | E002.BAS21 | E002.BAS21 | E002.JT | E002./ | E002. | E002. | E002.30.0只 | E002.30.0只 | E002.2024-10-20 00:00:00 |
| E003.半导体分立器件 | E003.GJB 244A/2A-2001 | E003.BZG3SH | E003.BZG3SH | E003.JT | E003./ | E003. | E003. | E003.117.0只 | E003.117.0只 | E003.2024-10-20 00:00:00 |
| E004.半导体分立器件 | E004.GJB 244A/2A-2001 | E004.2CZ103M | E004.2CZ103M | E004.JCT/K | E004./ | E004. | E004. | E004.4.0只 | E004.4.0只 | E004.2024-10-30 00:00:00 |
| E005.半导体分立器件 | E005.GJB 244A/2A-2001 | E005.BAS21 | E005.BAS21 | E005.JT | E005./ | E005. | E005. | E005.5.0只 | E005.5.0只 | E005.2024-08-30 00:00:00 |
| E006.半导体分立器件 | E006.GJB 244A/2A-2001 | E006.BZG3F | E006.BZG3F | E006.JCT | E006./ | E006. | E006. | E006.104.0只 | E006.104.0只 | E006.2024-12-30 00:00:00 |
| E007.半导体分立器件 | E007.GJB 244A/2A-2001 | E007.2CZ103M | E007.2CZ103M | E007.JCT/K | E007./ | E007. | E007. | E007.2.0只 | E007.2.0只 | E007.2024-08-30 00:00:00 |
| E008.半导体分立器件 | E008.GJB 244A/2A-2001 | E008.SY161AS | E008.SY161AS | E008.JCT/K | E008./ | E008. | E008. | E008.78.0只 | E008.78.0只 | E008.2024-10-20 00:00:00 |
| E009.半导体分立器件 | E009.GJB 244A/2A-2001 | E009.BAS21 | E009.BAS21 | E009.JT | E009./ | E009. | E009. | E009.1.0只 | E009.1.0只 | E009.2024-10-30 00:00:00 |
| E010.半导体分立器件 | E010.GJB 244A/2A-2001 | E010.BZ5245B | E010.BZ5245B | E010.G | E010./ | E010. | E010. | E010.15.0只 | E010.15.0只 | E010.2024-10-30 00:00:00 |
| E011.半导体分立器件 | E011.GJB 244A/2A-2001 | E011.MM3Z13VS | E011.MM3Z13VS | E011.JCT/K | E011./ | E011. | E011. | E011.47.0只 | E011.47.0只 | E011.2024-10-20 00:00:00 |
| E012.半导体分立器件 | E012.GJB 244A/2A-2001 | E012.2CZ103M | E012.2CZ103M | E012.JCT/K | E012./ | E012. | E012. | E012.10.0只 | E012.10.0只 | E012.2024-10-30 00:00:00 |
| E013.半导体分立器件 | E013.GJB 244A/2A-2001 | E013.BZ03C | E013.BZ03C | E013.JCT/K | E013./ | E013. | E013. | E013.150.0只 | E013.150.0只 | E013.2025-01-30 00:00:00 |
| E014.半导体分立器件 | E014.GJB 244A/2A-2001 | E014.BAS21 | E014.BAS21 | E014.JT | E014./ | E014. | E014. | E014.256.0只 | E014.256.0只 | E014.2024-10-20 00:00:00 |
| E015.半导体分立器件 | E015.GJB 244A/2A-2001 | E015.BC858SB | E015.BC858SB | E015.JCT/K | E015./ | E015. | E015. | E015.13.0只 | E015.13.0只 | E015.2024-12-30 00:00:00 |
| E016.半导体分立器件 | E016.GJB 244A/2A-2001 | E016.BAS21 | E016.BAS21 | E016.JT | E016./ | E016. | E016. | E016.148.0只 | E016.148.0只 | E016.2024-08-19 00:00:00 |
| E017.半导体分立器件 | E017.GJB 244A/2A-2001 | E017.BT2222AS | E017.BT2222AS | E017.JCT/K | E017./ | E017. | E017. | E017.208.0只 | E017.208.0只 | E017.2024-10-20 00:00:00 |
| E018.半导体分立器件 | E018.GJB 244A/2A-2001 | E018.BAS21 | E018.BAS21 | E018.JT | E018./ | E018. | E018. | E018.93.0只 | E018.93.0只 | E018.2024-08-30 00:00:00 |
| E019.半导体分立器件 | E019.GJB 244A/2A-2001 | E019.SY5649A | E019.SY5649A | E019.JCT/K | E019./ | E019. | E019. | E019.13.0只 | E019.13.0只 | E019.2024-12-30 00:00:00 |
| E020.半导体分立器件 | E020.GJB 244A/2A-2001 | E020.2CZP001 | E020.2CZP001 | E020.JT | E020./ | E020. | E020. | E020.104.0只 | E020.104.0只 | E020.2024-10-20 00:00:00 |
三、响应方式
有意参加本项目的企业，请与本公告截止时间之前 (略) （http://**）与该项目采购人员联系。按照采购单位要求在提交截止时间前提交询价响应文件，未按要求提交的视为无效响应。
一、采购清单
A.其他、B.其他、C.其他、D.其他、E.其他
二、主要内容
| 标题： | A.车|数控车铣|铣|钳等、B.自动车|仪表车|钳等、C.压制|钳|清洗|印字等、D.车|数控车铣|铣|钳等、E.半导体分立器件等 | ||
| 场次号： | A.XJ*、B.XJ*、C.XJ*、D.XJ*、E.XJ* | 询价开始时间： | A.2024-09-09 20:03:23、B.2024-09-09 20:03:25、C.2024-09-09 20:03:27、D.2024-09-09 20:03:29、E.2024-09-09 20:03:31 |
| 询价结束时间： | A.2024-09-23 00:00:00、B.2024-09-23 00:00:00、C.2024-09-23 00:00:00、D.2024-09-23 00:00:00、E.2024-09-23 00:00:00 | 参与方式： | A.定向询价、B.定向询价、C.定向询价、D.定向询价、E.定向询价 |
| 出价方式： | A.一次性出价、B.一次性出价、C.一次性出价、D.一次性出价、E.一次性出价 | 操作员： | A.吴妙满、B.吴妙满、C.吴妙满、D.吴妙满、E.程玲 |
| 联系人： | A.吴先生、B.吴先生、C.吴先生、D.吴先生、E.程先生 | 联系方式： | A.0571-*、B.0571-*、C.0571-*、D.0571-*、E.010-* |
| 付款方式： | A.、B.、C.、D.、E. | 附件： | (略) |
| 备注： | 全军武器装备 (略) 用户如需获取采购技术要求及资格要求等信息，请联系项目联络人并进行后续流程 | ||
| 产品名称 | 产品标准 | 型号 | 规格 | 质量等级 | 封装形式 | 产品批次 | 备注 | 采购数量 | 最少供应量 | 到货日期 |
| A001.车|数控车铣|铣|钳 | A001.- | A001.FD-50-21 | A001.FD-50-21 | A001.- | A001.无 | A001. | A001. | A001.444.0- | A001.444.0- | A001.2024-09-27 00:00:00 |
| A002.数车 | A002.- | A002.*-21 | A002.*-21 | A002.- | A002.无 | A002. | A002. | A002.30.0- | A002.30.0- | A002.2024-09-28 00:00:00 |
| A003.车|加工中心|钳 | A003.- | A003.*-11.3S | A003.*-11.3S | A003.- | A003.无 | A003. | A003. | A003.10.0- | A003.10.0- | A003.2024-09-09 00:00:00 |
| B001.自动车|仪表车|钳 | B001.- | B001.Y22-3-19 | B001.Y22-3-19 | B001.- | B001.无 | B001. | B001. | B001.500.0- | B001.500.0- | B001.2024-10-09 00:00:00 |
| B002.数控纵切 | B002.- | B002.*-01 | B002.*-01 | B002.- | B002.无 | B002. | B002. | B002.*.0- | B002.*.0- | B002.2024-10-15 00:00:00 |
| B003.数控纵切|仪表车|钳 | B003.- | B003.JYS-0000-103 | B003.JYS-0000-103 | B003.- | B003.无 | B003. | B003. | B003.500.0- | B003.500.0- | B003.2024-09-15 00:00:00 |
| C001.压制|钳|清洗|印字 | C001.- | C001.J7-62-12 | C001.J7-62-12 | C001.- | C001.无 | C001. | C001. | C001.100.0- | C001.100.0- | C001.2024-09-13 00:00:00 |
| C002.压制|钳|清洗|印字 | C002.- | C002.J599-2520-07 | C002.J599-2520-07 | C002.- | C002.无 | C002. | C002. | C002.100.0- | C002.100.0- | C002.2024-09-13 00:00:00 |
| C003.压制|钳|清洗|印字 | C003.- | C003.J599-2520-05 | C003.J599-2520-05 | C003.- | C003.无 | C003. | C003. | C003.100.0- | C003.100.0- | C003.2024-09-13 00:00:00 |
| D001.车|数控车铣|铣|钳 | D001.- | D001.*-105 | D001.*-105 | D001.- | D001.无 | D001. | D001. | D001.6.0- | D001.6.0- | D001.2024-09-04 00:00:00 |
| D002.车 | D002.- | D002.*-13.1 | D002.*-13.1 | D002.- | D002.无 | D002. | D002. | D002.30.0- | D002.30.0- | D002.2024-09-09 00:00:00 |
| D003.车|数控车铣|铣|钳 | D003.- | D003.*-105A | D003.*-105A | D003.- | D003.无 | D003. | D003. | D003.6.0- | D003.6.0- | D003.2024-09-04 00:00:00 |
| D004.加工中心|钳 | D004.- | D004.*-13(a)(b) | D004.*-13(a)(b) | D004.- | D004.无 | D004. | D004. | D004.11.0- | D004.11.0- | D004.2024-09-30 00:00:00 |
| E001.半导体分立器件 | E001.GJB 244A/2A-2001 | E001.BT2907AS | E001.BT2907AS | E001.JCT/K | E001./ | E001. | E001. | E001.208.0只 | E001.208.0只 | E001.2024-10-20 00:00:00 |
| E002.半导体分立器件 | E002.GJB 244A/2A-2001 | E002.BAS21 | E002.BAS21 | E002.JT | E002./ | E002. | E002. | E002.30.0只 | E002.30.0只 | E002.2024-10-20 00:00:00 |
| E003.半导体分立器件 | E003.GJB 244A/2A-2001 | E003.BZG3SH | E003.BZG3SH | E003.JT | E003./ | E003. | E003. | E003.117.0只 | E003.117.0只 | E003.2024-10-20 00:00:00 |
| E004.半导体分立器件 | E004.GJB 244A/2A-2001 | E004.2CZ103M | E004.2CZ103M | E004.JCT/K | E004./ | E004. | E004. | E004.4.0只 | E004.4.0只 | E004.2024-10-30 00:00:00 |
| E005.半导体分立器件 | E005.GJB 244A/2A-2001 | E005.BAS21 | E005.BAS21 | E005.JT | E005./ | E005. | E005. | E005.5.0只 | E005.5.0只 | E005.2024-08-30 00:00:00 |
| E006.半导体分立器件 | E006.GJB 244A/2A-2001 | E006.BZG3F | E006.BZG3F | E006.JCT | E006./ | E006. | E006. | E006.104.0只 | E006.104.0只 | E006.2024-12-30 00:00:00 |
| E007.半导体分立器件 | E007.GJB 244A/2A-2001 | E007.2CZ103M | E007.2CZ103M | E007.JCT/K | E007./ | E007. | E007. | E007.2.0只 | E007.2.0只 | E007.2024-08-30 00:00:00 |
| E008.半导体分立器件 | E008.GJB 244A/2A-2001 | E008.SY161AS | E008.SY161AS | E008.JCT/K | E008./ | E008. | E008. | E008.78.0只 | E008.78.0只 | E008.2024-10-20 00:00:00 |
| E009.半导体分立器件 | E009.GJB 244A/2A-2001 | E009.BAS21 | E009.BAS21 | E009.JT | E009./ | E009. | E009. | E009.1.0只 | E009.1.0只 | E009.2024-10-30 00:00:00 |
| E010.半导体分立器件 | E010.GJB 244A/2A-2001 | E010.BZ5245B | E010.BZ5245B | E010.G | E010./ | E010. | E010. | E010.15.0只 | E010.15.0只 | E010.2024-10-30 00:00:00 |
| E011.半导体分立器件 | E011.GJB 244A/2A-2001 | E011.MM3Z13VS | E011.MM3Z13VS | E011.JCT/K | E011./ | E011. | E011. | E011.47.0只 | E011.47.0只 | E011.2024-10-20 00:00:00 |
| E012.半导体分立器件 | E012.GJB 244A/2A-2001 | E012.2CZ103M | E012.2CZ103M | E012.JCT/K | E012./ | E012. | E012. | E012.10.0只 | E012.10.0只 | E012.2024-10-30 00:00:00 |
| E013.半导体分立器件 | E013.GJB 244A/2A-2001 | E013.BZ03C | E013.BZ03C | E013.JCT/K | E013./ | E013. | E013. | E013.150.0只 | E013.150.0只 | E013.2025-01-30 00:00:00 |
| E014.半导体分立器件 | E014.GJB 244A/2A-2001 | E014.BAS21 | E014.BAS21 | E014.JT | E014./ | E014. | E014. | E014.256.0只 | E014.256.0只 | E014.2024-10-20 00:00:00 |
| E015.半导体分立器件 | E015.GJB 244A/2A-2001 | E015.BC858SB | E015.BC858SB | E015.JCT/K | E015./ | E015. | E015. | E015.13.0只 | E015.13.0只 | E015.2024-12-30 00:00:00 |
| E016.半导体分立器件 | E016.GJB 244A/2A-2001 | E016.BAS21 | E016.BAS21 | E016.JT | E016./ | E016. | E016. | E016.148.0只 | E016.148.0只 | E016.2024-08-19 00:00:00 |
| E017.半导体分立器件 | E017.GJB 244A/2A-2001 | E017.BT2222AS | E017.BT2222AS | E017.JCT/K | E017./ | E017. | E017. | E017.208.0只 | E017.208.0只 | E017.2024-10-20 00:00:00 |
| E018.半导体分立器件 | E018.GJB 244A/2A-2001 | E018.BAS21 | E018.BAS21 | E018.JT | E018./ | E018. | E018. | E018.93.0只 | E018.93.0只 | E018.2024-08-30 00:00:00 |
| E019.半导体分立器件 | E019.GJB 244A/2A-2001 | E019.SY5649A | E019.SY5649A | E019.JCT/K | E019./ | E019. | E019. | E019.13.0只 | E019.13.0只 | E019.2024-12-30 00:00:00 |
| E020.半导体分立器件 | E020.GJB 244A/2A-2001 | E020.2CZP001 | E020.2CZP001 | E020.JT | E020./ | E020. | E020. | E020.104.0只 | E020.104.0只 | E020.2024-10-20 00:00:00 |
三、响应方式
有意参加本项目的企业，请与本公告截止时间之前 (略) （http://**）与该项目采购人员联系。按照采购单位要求在提交截止时间前提交询价响应文件，未按要求提交的视为无效响应。
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