上海集成电路研发中心有限公司全自动12寸晶圆键合超声扫描检测系统设备
上海集成电路研发中心有限公司全自动12寸晶圆键合超声扫描检测系统设备
Project Name：Shanghai IC R&D CENTER Automatic 12 - inch wafer - bonded ultrasonic scanning detection system equipment
Bidding NO：****-********0740
Bidding Content：Automatic 12 - inch wafer - bonded ultrasonic scanning detection system equipment
Bidding Agency：Shanghai Machinery & Electric Equipment Tendering Co.Ltd
Purchasers：Shanghai IC R&D Center
Open-Time of Bids：2017-04-11 15:00
Ending Date of Evaluation Result：2017-04-17 23:59
Who proposed the successful bidder：
| 1 | Micro-Power Scientific(H.K.) Co., Limited | SONOSCAN,Inc. | USA |
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